by T Stockmeier

Aug 12, 2011 – SEMIKRON is an internationally leading power semiconductor manufacturer. . SKiN technology makes it possible to fit a 3 MW wind power .

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Semikron's New SKiN Technology is a packaging technology which is based on the use of a flexible foil and sintered connections rather than bond wires, .

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May 27, 2011 – Semikron has developed a revolutionary packaging technology for power semiconductors which does away with . The new SKiN Technology.

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Semikron has developed a new packaging technology for power semiconductors which does away with bond wires, solders and thermal paste. The new SKiN .

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May 17, 2011 – SKiN Technology replaces wire bonding. Nuremberg, 17 May 2011 - Semikron has developed a revolutionary packaging technology for power .

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Aug 12, 2011 – NEW DELHI: The German-based power semiconductor manufacturer Semikron is showcasing its newly developed packaging technology SKiN .

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About · SKiN Technology · SEMIKRON · IGBT Module · IPM – Intelligent Power Modules · CIB – Converter Inverter Brake · MOSFET Modules · Thyristor/ Diode .

Replacing wire bonds with a sintered SKiN flex layer; Double-sided chip sintering for excellent thermal and electrical chip characteristics; Continuous sinter layer .

SPRiNG Technology · SKiiP Technology · SiNTER Technology · SKiN Technology . Semikron geared for further growth. Opening of modern logistics centre .

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Power semiconductor specialist Semikron has developed a new packaging . Called SKiN technology, the approach is based on the use of a flexible foil and .

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